How to Package PCB during Manufacturing Industry?

In its simplest form, SMD package selection may be thought of as identifying a device that meets your functionality requirements while fitting within any space restrictions or limitations your design may have. However, you should also incorporate rules and guidelines for your board’s fabrication and PCB assembly; this is best done by including your contract manufacturer (CM) early in the design process. By collaborating with your CM before and during the prototyping process, you can utilize SMD package selection options that may reduce board turnaround time and cost. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } In this passage, we are providing all the information about package PCB during the PCB manufacturing. If you are looking for more professional knowledge about PCB package, please check and read the content below for more. What are the classifications of PCB packaging? If the PCB package is distinguished according to the installation method, it can be divided into mounted devices, plug-in devices, mixed devices (mounting and plug-in devices exist at the same time), and special devices. Special devices generally refer to sinker devices. PCB packaging can be divided into the following categories if it is distinguished by function and device shape: SMD: Surface Mount Devices / surface mount components. RA: Resistor Arrays / exclusion. MELF: Metal electrode face components/metal electrode face components without lead CFP: Ceramic Flat Packs/Ceramic Flat Pack. PQFP: Plastic Quad Flat Pack/Plastic Quad Flat Pack. SQFP: Shrink Quad Flat Pack/Shrink Quad Flat Pack. CQFP: Ceramic Quad Flat Pack/Ceramic Quad Flat Pack. PLCC: Plastic leaded chip carriers/ plastic packaged leaded chip carriers. LCC: Leadless ceramic chip carriers/ leadless ceramic chip carriers. QFN: Quad Flat Non-leaded package/Four-side no lead flat package. DIP: Dual-In-Line components. PBGA: Plastic Ball Grid Array/Plastic Ball Grid Array device. RF: Radio frequency and microwave devices. AX: Non-polarized Axial-Leaded Discretes/non-polarized axial pin discrete components. CPAX: Polarized capacitor, axial/polarized axial pin capacitor. CPC: Polarized capacitor, cylindricals/ with polarized cylindrical capacitors. CYL: Non-polarized cylindricals/non-polarized cylindrical components. DIODE: diode. LED: Light-emitting diode. DISC: Non-polarized Offset-leaded Discs/discrete components with no polarity bias pins. RAD: Non-polarized Radial-Leaded Discretes/Non-polarized Radial-Leaded Discretes. TO: Transistors Outlines, JEDEC compatible types/transistor shapes, JEDEC component types. VRES: Variable resistors/adjustable potentiometer. PGA: Plastic Grid Array / plastic package array device. RELAY: Relay/relay. SIP: Single-In-Line components/single-row pin components. TRAN: Transformer/transformer. PWR: Power module/power module. CO: Crystal oscillator/ crystal oscillator. OPT: Optical module/optical device. SW: Switch/switch device (specially refers to non-standard package). IND: Inductance/inductance (specially refers to non-standard packages). What are the advantages of package? PoP technology is being widely applied by OEMs owing to its impressively advantages: • Flexibility - Stacking structure of PoP provides OEMs such multiple selections of stacking that they are able to modify functions of their products at ease. For example, they are allowed to modify low-memory chip into high-memory chip to cater to newly-coming demands without need to change circuit board design of motherboard. • Overall size reduction • Shrinking overall cost • Reducing motherboard complexity • Improving logistics management • Enhancing technology reuse level

PCB Knowledge ⋅ 01/09/2023 15:24

What Is PCB Thermal Analysis for PCB Industry?

In high power density PCB, it is difficult to control heat generation. This occurs because there are many channels of traction power at the same time and many elements that depend on the current supply at the same time. High power density PCBS are not necessarily bad designs; Some applications require high power density to perform various functions. In these cases, the efficient use of space is critical, as any crosstalk may quickly cause a thermal peak. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } If you are looking for more information about PCB Thermal, please check and read the content below for more professional knowledge in this passage. What is the Importance of PCB thermal management? Current silicon-based components have a junction temperature between about 125°C and 200°C. However, it is necessary to avoid reaching this value, otherwise the residual life of the component will deteriorate rapidly. In fact, it is estimated that an increase in operating temperature of 20°C, due to inefficient thermal management, can reduce component life by up to 50%. High brightness LEDs, for instance, convert over 60% of the absorbed power into heat and therefore require special printed circuit boards capable of handling high temperatures without damaging the components. The growing popularity of wide bandgap (WBG) semiconductors, such as gallium arsenide (GaN) and silicon carbide (SiC), has allowed components to reach higher operating temperatures than silicon-based technology. This, however, has not eliminated the need for accurate thermal management, capable of evenly distribute the generated heat, avoid the formation of dangerous heat accumulation points (hot spots) and minimizing power losses. Figure 1 shows an electronic circuit subjected to thermal scanning by infrared camera: the red colored parts correspond to the points of greatest heat concentration. What is the defination of PCB thermal paste? The most generic definition for thermal paste is that it is a paste chemically constructed to allow for heat transfer. Its composition is a liquid polymer, that may include urethanes, acrylates, silicones and epoxies. The most typical function for thermal paste is as a filler between two surfaces to provide a solid interface and increase the volume of heat transfer between the surfaces. With this primary function it may be surprising that the heat transfer rate may range from approximately 3W/(m·K) to 13W/(m·K) for non-metallic pastes, which is far below the 385W/(m·K) for 99% pure copper. What is the motivation of PCB thermal management? The main reason for deficiencies of electrical systems beside dust, vibration and humidity is by far the impact of temperature. Therefore an efficient thermal management concept on the PCB is crucial for the reliability of power electronic systems. As an example we take high power LED applications, which are likely to dominate in the next years residential and commercial lighting, signaling and vehicle headlights due to efficiency and extended lifetime. LEDs that range from 500 milliwatts to as much as 10 watts in a single package have become standard, and researchers expect even higher power in the future. Thermal management is of critical importance for high power LEDs. More than 60% of the electrical power input is converted into heat and built up at the junctions of LED chips due to non-radiative recombination of electron-hole pairs and low light extraction. If that heat is not removed, the LEDs run at high temperature, which not only lowers their efficiency, but also makes the LED more dangerous, less reliable and shortens operating life. Thus, thermal management of high power LEDs is a crucial area of research and development. In this paper results of simulations and measurements of different LED-modules will be shown and should serve as representative of thermal solutions for general high power applications. What are the techniques of thermal management in PCB? PCB fabrication requires both heat and pressure in order to laminate the layers together, while the soldering process will heat the board up during assembly. Wave soldering will run the exposed components leads on the bottom side of the board through a molten wave of solder, and solder reflow requires the entire board to be baked in an oven. Here are some of the thermal problems that are associated with circuit board manufacturing: Bow and twist: If the metal coverage throughout the different layers of the board is not consistent, it can cause the board to bow or twist during fabrication. For instance, if the first three layers of a six-layer board have a higher percentage of metal than the bottom 3 layers, the board will be out of balance. This imbalance can result in the board warping as the high heat and pressure are applied during fabrication. Bad solder joints: These often happen because the metal around the pin to be soldered behaves as a heat sink and robs heat from the connection during wave solder. As a result, the solder doesn’t melt correctly, leaving a cold and unreliable solder joint. The solution in cases like this is to use a thermal relief pad to concentrate the heat on the solder joint. A thermal relief pad from a PCB design CAD system A thermal relief pad like this will help focus the heat on the pin to create a better solder joint Tombstoning: This is a condition where a thermal imbalance between the two pins of a small surface mount component causes the part to stand up vertically during solder reflow, just like a tombstone. The thermal imbalance occurs when one of the pins is connected to a large area of metal, which acts as a heat sink. This allows the solder on the other pin to melt faster pulling the part up with it. To prevent this, PCB designers should use thermal relief type connections when connecting pins to large areas of metal.

PCB Knowledge ⋅ 01/06/2023 15:46

How to Check Signal Integrity in the PCB Industry for Beginner?

Extensive research has been done on the best way to design transmission lines so high-speed signals can travel at maximum efficiency. To minimize potential signal integrity issues and other transmission-related problems, it is crucial to ensure that your PCB supplier delivers circuit boards with a robust and reliable design. PCB Instant QuoteIn this passage, we will provide you all the details about signal integrity in PCB design process. If you are a beginner of PCB industry and curious about the signal integrity in PCB design, please check and read the content below in this passage. How to process the proper routing for signal integrity in PCB? Just like adequate grounding, establishing an appropriate routing path is essential for maintaining signal integrity. For designers aiming to avoid signal integrity problems, proper routing is a non-negotiable step. In the field of electronic design, "routing" is a frequently mentioned term. Wire routing—often simply referred to as "routing"—is one of the core steps in the printed circuit board design workflow.Correctly routing all cables is critical, especially when it comes to eliminating signal integrity issues. Regrettably, many circuit designers often overlook this step. For example, signal cables must be routed away from power sources and all electrical fixtures. Higher voltages tend to generate increased electrical noise, which is a common cause of signal integrity problems. Electric motors, for instance, are not ideal to place near signal cables, as they typically produce magnetic fields that can interfere with signals.The question of how far to route signal cables from such noise sources depends on factors like the size of the magnetic field and the voltage level. However, the key priority is to take all necessary measures to prevent signal noise caused by improper routing. How to invest the termination for signal integrity in PCB? A terminating resistor is essential when you want to avoid signal integrity problems. Terminating resistors are signal quality components. Designers use them in soaking up AC signals. They do this to prevent reflections on the line. Unmatched impedance along transmission lines will result in signal integrity problems. Termination resistors bring about the desired signal integrity. Termination resistors increase performance and speed and reduce intermittent errors. By investing in terminating resistors, designers can do away with a lot of noise. This way, they will be able to improve signal integrity during PCB design. The main aim of terminating resistors is to improve signal integrity. But, designers need to select the best fit suitable for their applications. Some of them include: · Parallel Termination · RF termination · AC Termination· Thevenin Termination· Series Termination What are the challenges during signal integrity in PCB? PCB signal integrity issues mainly include signal reflection, crosstalk, signal delay, and timing errors. Reflection When the signal is transmitted on the transmission line, when the characteristic impedance of the transmission line on the high-speed PCB does not match the source impedance or load impedance of the signal, the signal will be reflected, causing the signal waveform to overshoot, undershoot and the ringing phenomenon caused by it. Overshoot refers to the first peak (or bottom) of the signal transition. It is an additional voltage effect above the power supply level or below the reference ground level. Undershoot refers to the signal jump change to the next valley (or peak). Excessive overshoot voltage often impacts the device for a long period of time, causing damage to the device. Undershoot will reduce the noise margin. Ringing increases the time required for signal stabilization, which affects system timing. Crosstalk In PCB, crosstalk refers to the undesired noise interference caused by the electromagnetic energy through the mutual capacitance and mutual inductance coupling to the adjacent transmission line when the signal propagates on the transmission line. It is caused by interaction of different structures of the electromagnetic field in the same area. Mutual capacitance causes coupling current, which is called capacitive crosstalk; while mutual inductance causes coupling voltage, which is called inductive crosstalk. On the PCB, crosstalk is related to trace length, signal line spacing, and the condition of the reference ground plane. Signal delay and timing error The signal is transmitted at a limited speed on the wires of the PCB, and the signal is sent from the driver to the receiver, with a transmission delay in between. Excessive signal delays or mismatched signal delays can lead to timing errors and disrupted logic device functionality.

PCB Knowledge ⋅ 01/04/2023 14:32

5 Main Tips of BGA PCB Layout Guidelines for PCB Industry

BGA chips win over QFP (quad flat package) chips in terms of the shape of BGA packages. BGA packages make the physical size of chips dramatically reduced with solder ball array replacing peripheral leads at QFP chips, which is especially obvious when multiple I/O pins are available. The surface area of BGA linearly increases with the improvement of I/O pin count while that of QFP increases with the improvement of I/O pin count square. As a result, BGA package provides more manufacturability to components with multiple pins than QFP. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Are you going to learn more about details of BGA PCB layout? If you are searching for BGA PCB layout, you can check and read the content below for more knowledge in this passage. How to avoid BGA PCB defects? During the process from lead manufacturing to lead-free manufacturing, reflow soldering and wave soldering temperature has to rise up due to SMT (surface mount technology) assembly requirement. Some people simply believe it OK that substrate material with high Tg (glass transition temperature) is selected for PCB board. They just think that it's essential to manage and control Z-axis expansion. The primary aim is to stop delamination from taking place of thick circuit boards and 14-layer or more PCBs and to stop cracks from occurring to PTH (plated through hole) because a large extent of Z-axis expansion of PCB tends to lead PTH hole wall to break during reflow or wave soldering. Nevertheless, Tg fails to defeat cracks generated during lead free process unless Td (temperature of de-composition) is considered to totally solve PCB cracks issue. Three levels of Td are regulated in IPC concerning PCB substrate material: 310°C, 325°C and 340°C. What are the features of BGA? · More I/O. Since BGA encapsulated solder balls are arranged under the encapsulated substrate in the form of array, the number of I/O of the device is greatly increased, the size of the encapsulation body is reduced, and the space od assembly is saved. · High packaging yield reduces cost. · The contact surface between BGA’s array welding ball and substrate is large and short, which is conducive heat dissipation. · The pin of BGA array welding ball is short, which shortens the signal transmission path, reduces the lead inductance, electrical resistance and improves the circuit performance. · Improve the coplanability of I/O terminal and reduce the loss caused by poor coplanability in the assembly process. · BGA is suitable for MCM encapsulation and can achieve high density and high performance of MCM. · The IC of BGA and fpBGA is stronger and more reliable than the foot-shaped package of detail spacing. · How to process the BGA PCB layout control? · During stencil design phase, four corners and each side of BGA component should be 1mil to 2mil larger than those of pad. Stencil opening size should be designed based on specs of BGA components including pitch, soldering balls on BGA and ingredient of soldering balls. · During the process of printing, support pin shouldn't be against BGA to stop fake soldering and pillow effect from taking place due to contamination of BGA pad. Furthermore, especially much attention has to be paid to printing scraper pressure and printing quality control. · Wafer positions of pickup BGA, component thickness setting and pressure amount of pickup should be emphasized during mounting stage. · There are more opportunities for cracks during IR reflow and special attention has to be paid: What are the reasons of BGA soldering defects? Incorrectly-Picked Tg and Td of PCB Substrate Material During the process from lead manufacturing to lead-free manufacturing, reflow soldering and wave soldering temperature has to rise up due to SMT (surface mount technology) assembly requirement. Some people simply believe it OK that substrate material with high Tg (glass transition temperature) is selected for PCB board. They just think that it's essential to manage and control Z-axis expansion. The primary aim is to stop delamination from taking place of thick circuit boards and 14-layer or more PCBs and to stop cracks from occurring to PTH (plated through hole) because a large extent of Z-axis expansion of PCB tends to lead PTH hole wall to break during reflow or wave soldering. Nevertheless, Tg fails to defeat cracks generated during lead free process unless Td (temperature of de-composition) is considered to totally solve PCB cracks issue. Three levels of Td are regulated in IPC concerning PCB substrate material: 310°C, 325°C and 340°C. In conclusion, during the process of substrate material determination, the higher Tg and Td are, the better. But PCB fabrication cost is an essential consideration based on which substrate material with agreeable Tg and Td should be picked up. Insufficient Gel Content in Prepreg Insufficient gel content in prepreg used on external layers and between internal layers tends to lead copper foil to generate bubbles under high temperature. Unsuitable Copper Profile Selection Generally, ordinary profile is classified into three categories: standard profile, lower profile and very lower profile. Standard profiles contain no regulations on copper sheet because adhesiveness is high but too high profile tends to cause bad etching, which further reduces stability of line width and impedance control. Lower profile regulates that maximum Profile SPEC is 0.4mil (10.2μm). Up to now, lower profile has been leveraged by most PCB manufacturers. Very lower profile regulates that maximum Profile SPEC is 0.2mil (5.1μm), which is generally only leveraged in multilayer PCB fabrication with special fine line requirement such as 2mil trace width.

PCB Knowledge ⋅ 01/03/2023 14:05

What Is a BGA Chip during for PCB Designers in Industry?

The BGA package began to make headlines as the next step in packaging technology. They offered higher interconnect density than both thru-hole PGA’s and surface-mount QFPs at comparable costs without the manufacturing problems associated with those packages. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } If you are looking for more professional BGA chip during the PCB layout, please check and read the content in this passage. What is the basic definition of BGA chip during the PCB layout? BGA chips win over QFP (quad flat package) chips in terms of the shape of BGA packages. BGA packages make the physical size of chips dramatically reduced with solder ball array replacing peripheral leads at QFP chips, which is especially obvious when multiple I/O pins are available. The surface area of BGA linearly increases with the improvement of I/O pin count while that of QFP increases with the improvement of I/O pin count square. As a result, BGA package provides more manufacturability to components with multiple pins than QFP. Generally speaking, I/O pin count ranges from 250 to 1089, which is specifically determined by packaging type and size. As far as manufacturability is concerned, BGA chips also perform better than QFP chips. The pins of BGA package chips are ball-shaped and are distributed in 2D array. Moreover, I/O pins feature larger pitch than QFP and perform as hard balls that won't be deformed due to contact. When it comes to chip manufacturers, another merit of BGA chips lies in its high yield. The assembly defect rate of BGA chips is normally at 0.3ppm to 5ppm per pin that can be regarded as equivalently no defect. What are the classifications of BGA in PCB? There are many types of BGA packaging, the general shape structure is square or rectangular. According to the arrangement mode of solder ball welding, it can be divided into peripheral type, staggered type and full array type BGA. According to the different substrates, it can be divided into 3 types as following: · PBGA (Plastic Ball Grid Array) · CBGA (Ceramics Ball Grid Array) · TBGA (Tape Ball Grid Array) What are the issues of processing BGA in PCB? · Operators must wear electrostatic bracelets. · Should adjust the airflow and pressure of the hot air gun in advance before desoldering BGA · The temperature of the hot air gun should be well set in advance (generally controlled at 280~320℃) to prevent the chip from being damaged by excessively high temperature in the process of desoldering. It should not adjust the temperature again during desoldering. · When desoldering BGA, gently touch the BGA with tweezers to confirm whether the solder on the pad melts away to prevent the BGA pad on the circuit board from being damaged. · To avoid secondary ball soldering, the orientation marked on the PCBA , should be paid attention to when repairing the BGA. How to process BGA soldering in PCB? Dip a small amount of dense flux on the BGA tin balls and PCBA pads, retrieve the original mark and place the BGA. The BGA should be glued and positioned to prevent it from being blown away by hot wind. However, it should be noted that too much flux should not be put in. Otherwise, excessive bubbles of rosin will cause the chip to shift when heating. PCBA board also is fixed on the BGA rework platform and must be placed level, change the suitable nozzle, nozzle on the BGA chip and left 4 mm, choose BGA to rework stations primary set temperature curve, click on the screen of automatic soldering (note: will not apply pressure on BGA soldering process, easy to cause a short circuit between tin ball under the.) With the melting of the BGA tin ball and the formation of the PCBA solder pad soldering, and through the surface tension of the tin ball, the chip will automatically center even if there is a deviation from the motherboard. When the BGA repair table is heated, the BGA soldering operation will be completed at this time. However, it should be noted that the BGA repair table will make an alarm sound after heating. What is the importance of BGA in PCB? BGA sockets are used for surface-mounting BGAs onto PCBs. BGA sockets help to mount the BGA chips onto PCBs without much hassle. The main problem of mounting an IC onto a PCB is that it can be very difficult to locate the pins of the IC on a PCB and solder them individually. Also, the mounting process can be very time consuming and frustrating if not done correctly. By using BGA sockets, these problems are solved. A BGA socket is made of plastic in the shape of a rectangle and has spaces on its underside to accommodate each solder ball of the BGA chip. BGA sockets come in two types: active and passive. An active BGA socket has electrical contacts on its underside to which the solder balls of the BGA chip are connected. A passive BGA socket does not have any contact pads on its underside. Instead, it is connected to a PCB using through-holes or surface mount technology (SMT) components. In this article, we will only be looking at active BGA sockets. BGA sockets are available in a variety of sizes depending on the size of the BGA chip that they are designed to accommodate. Some BGA sockets are designed to accommodate only one BGA chip, while others accommodate two or even four chips. The size of a BGA socket is usually specified in terms of the number of rows and columns on its underside. For example, if a BGA socket is designed to accommodate a 4×4-ball BGA chip, then it would have 16 contact pads arranged in 4 rows and 4 columns.

PCB Knowledge ⋅ 12/29/2022 16:10

How Much Does PCB Assembly Cost for PCB Industry?

Going for a cheap PCB assembly phase may be tempting if you are working with a tight budget or tight timeline for your next project. But it’s essential to be conscious that PCB assembly costs can differ wildly between companies. Your PCBs’ quality will have a significant impact on the way your product performs, both now and down the line. Also, anytime you are talking about PCB assembly cost, you’re talking about your PCBs’ reliability, longevity, performance, and functionality for years to come. If you are curious about the cost of PCB assembly, please follow us, check and read the content below for more professional knowledge.If you want to order PCB product, please check and custom your order online. Why we need to calculate PCB assembly cost? Sometimes, PCB assembly costs and engineering costs will be included in purchasing quotation. It needs to cover about 5% of the material loss when purchasing the components, due to the reason of material loss, like resistance and capacitance disk loading material and SMT chip. For the small batch of PCBA, engineering costs are usually covered in quotation, including the costs of processing file, stencil, Changing SMT line etc. If the last time you ordered anything was over six months ago, it’s time to talk with your supplier about pricing for new orders. You may think you know your costs, but if your costs are different from everyone else’s, that’s a sign of variability, and it doesn’t bode well for reliability and performance. It is not to say that some companies will charge more while others will charge less. It only means the cost of PCB assembly can vary hugely between companies. What are the main factors affects PCB assembly cost? For instance, a PCB assembled in South Asia is generally several times less expensive than one built in North America or Western Europe. However, overseas manufacturing can drive up costs due to shipping, handling, and communication delays. Therefore, cheap manufacturing can include unforeseen costs that need to be accounted for before contracting an overseas manufacturer. Turnaround TimeWhen we’re asked “how much does PCB assembly cost” one of the first responses that come to mind is: what is the expected turnaround time? Turnaround time refers to the span of time that is required to complete the manufacturing process and satisfy the buyer’s request. As a rule, faster turnaround expectations come at a higher cost. QuantityWhen it comes to manufacturing, higher quantities result in lower assembly costs due to economies of scale. In other words, when products are created at a larger scale, the unit price of each PCB drops significantly. This economic phenomenon occurs because many of the factors that drive up assembly prices, like startup costs and programming, only affect the initial units produced—all proceeding units can be created without swallowing these costs. TechnologyAnother key aspect of PCB assembly pricing is the type of technology used. On one hand, surface mount technology (SMT) can provide cost savings to manufacturers because setup costs are lower and automation is heavily involved. However, SMT can result in the need for through-hole drilling to fit additional surface mount devices (SMDs) which can skyrocket costs. Parts PackagingSome parts involve more labor to package and properly assemble. For instance, electric equipment like BGAs requires more time and effort to package because they must be connected to an electrical source. Since BGAs have electrical pins, assembly costs can shoot up dramatically since they must undergo an X-ray examination to check for short-circuiting. How is PCB assembly cost calculated? PCB costAll factors we have mentioned above. Component procurement costComponent procurement cost is a part of pcb board cost. Components Procurement cost is the mainly cost in PCBA SMT Processing. The PCBA manufacturer purchases the components according to the BOM. Number of solder padsSolder pads cost is a part of pcb board cost. The number of solder pads is the decisive factor in SMT price. Now the SMT quotation is basically in accordance with the number of solder pads to calculate, the more solder pads, the price is higher. The solder pads are different, the pcb assembly cost is also different. Engineering cost/set-up costEngineering cost is a part of PCB board cost. A few years ago, there were engineering cost/set-up costs, especially in the small quantity orders, factories often charged that, now these costs are included in the PCB assembly cost and SMT cost. SMT assembly cost (SMD+DIP)SMT assembly cost is a part of PCB board cost. Another key aspect of PCBA pricing is the type of assembly technology used. Surface mount technology (SMT) can save money due to low installation costs and high precision of automation. The DIP soldering will cost more as this process need more manual soldering, so labor cost will be added, and pcb assembly price will be high. PCBA testing costPCBA testing cost is a part of PCB fabrication cost. If customers need extra PCBA function test or programming, the extra PCB testing fee will be charged. Wanna know PCB knowledge? Check and read for more.

PCB Knowledge ⋅ 12/28/2022 15:47

All Useful Basics about RF PCB Design Considerations for Engineers

RF circuits are non as intuitive as typical circuit diagrams, and sometimes a diagram may appear to violate basic electrical design rules. However, due to the propagating nature of the electromagnetic field, circuits running at RF frequencies act very differently from typical integrated circuits operating at DC or in digital bands. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } The higher frequency of RF PCBs makes it more complicated in their creation and design. There are four factors to consider before developing a blueprint for designing an RF PCB. In this passage check and read all the content about RF PCB design. What are the guidelines about RF PCB design? Routing your RF board to ensure signal integrity is just as much about designing the right layer stack as it is about laying traces. You can suppress transmission line effects in your signal lines with the right layer stack in your PCB. While normally discussed in terms of digital signals, signal reflection at an impedance discontinuity affects analog signals when traces operate as transmission lines. When the propagation delay along an interconnect is greater than one-quarter the oscillation period of the analog signal, then you will need to worry about transmission line effects and ensure that your traces are impedance matched. Although there is some natural attenuation of a reflected signal in an analog signal trace, the analog traces are constantly pumped with a harmonic source, and a reflected signal can form a standing wave in a trace if reflected at an impedance discontinuity. The natural attenuation in the signal trace only dampens the maximum amplitude at resonance, it does not completely eliminate resonance. Any analog signal resonance on a transmission line can form a standing wave along the trace (depending on the geometry), creating a high amplitude electric field that can induce noise in other areas of the board. You can eliminate this problem if your traces are impedance matched with your source and load components. How to select right material for RF PCB? Materials commonly used in PCB fabrication, such as FR-4 (flame retardant level 4), are very cheap but are generally not the most suitable choice for high frequency RF applications, especially considering the non-uniformity of the dielectric constant and a worse tangent angle. For RF PCBs, specific materials are used, such as FEP, PTFE, ceramic, hydrocarbons, and various types of glass fiber. The PFE and PTFE materials, belonging to the fluoropolymer family, improve the chemical resistance of the base material, have anti-adhesion and smoothness properties, as well as an extraordinary heat resistance. If budget is not a problem and quality is more important than price, the best solution is PTFE with fiberglass, eventually woven glass fiber. What is RF reflection in PCB design? RF reflection functions similarly to how sound is bounced back and creates an echo. It’s also analogous to waves of water crashing and bouncing back. The reflection occurs because the wave encounters a discontinuity of the medium that it’s traveling, and that’s the same for reflected RF waves. RF reflection must be considered when discussing transmission lines. One of the basic principles of transmission lines is to ensure that the characteristic impedance of the driver, traces, and load are matched. Characteristic impedance is not defined by the resistance or the trace length but rather determined by the dielectric, trace width, and the separation between the trace and the plane. What is the process of RF PCB trace routing? As with any high-speed routing, short, direct routing with varying widths will be necessary for controlled impedance routing and higher-current power traces. Here are some other points about RF routing to keep in mind: · Most trace routing must be manually added for specific RF topologies. · Setting up and using your design rules is critical to success. · Routing features such as copy and paste may also prove useful when replicating areas of similar circuitry. · Curved trace corners or mitered corners will help reduce impedance fluctuations. · Vias provide fencing around areas of the ground plane for shielding. In some RF designs, some areas of routing will be treated as components. This routing requires specialized tools that can accommodate parametric component routing to send these trace segments, which are now lumped components, into RF analysis systems. For power and ground planes, prepare for higher power requirements in RF designs and ensure that the thermal reliefs can handle the current while facilitating automated soldering. Some copper pours, and planes in an RF design may need to be converted into lumped components for RF analysis. It may also be necessary to create unusually shaped metal areas for unique RF elements using the drafting capabilities of your CAD tools and then convert those areas into intelligent net objects. As you can see, RF design may involve some new and exciting methods of laying out a circuit board. Now let’s look at what your manufacturer will need from you to build this circuit board.

PCB Knowledge ⋅ 12/27/2022 14:12

How to Measure PCB Trace Impedance in Layout with 3 Tips?

Every trace has a small, nearly indistinguishable series inductance distributed along the trace with an inverse relationship to the cross-section of the trace. As rise times increase, the resulting impedance becomes more noticeable. By the same token, each trace has capacitance distributed along the trace and the return path signal, which is a function of the width of the trace and the dielectric of the material between the signal return path and the trace. Once again, if rise times increase enough, the impedance generated as the current tries to flow through this capacitance can be significant. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } If you are curious about PCB trace impedance, you can check and read the content below for more information and professional knowledge. How to measure PCB trace impedance? To manufacture controlled impedance printed circuit boards, one must be able to measure impedance. The best way to calculate trace impedance is by using a trace impedance calculator. You can find trace impedance calculators online or in your CAD software. There are several parameters to consider when determining impedance, including: · Trace width · Trace thickness · Laminate thickness · Dielectric thickness · Copper weight Once you have calculated all relevant parameters, you can adjust the all of the above (typically the trace width) to arrive at the impedance you are looking for. Once you think you are at an acceptable impedance, you can test the board’s effectiveness using test coupons manufactured on the same panel at the same time, so you can get a good impedance rating without the challenges of accessing the traces on the actual board. The test coupon traces should be identical to the board traces in order to get an accurate test. Typically, the manufacturer will build test coupons on either end of the production panel so that by testing both coupons, you get a very reliable impedance reading without damaging the board. Testers measure impedance with a Time Domain Reflectometer (TDR) or a network analyzer. Impedance can be measured using a network analyzer, a laboratory Time Domain Reflectometer (TDR) or a controlled impedance test system that employs TDR techniques. An engineer with practice using controlled impedance test systems will run the impedance test to ensure high-quality results. What is the work principle of PCB trace impedance? Every trace has a small, nearly indistinguishable series inductance distributed along the trace with an inverse relationship to the cross-section of the trace. As rise times increase, the resulting impedance becomes more noticeable. By the same token, each trace has capacitance distributed along the trace and the return path signal, which is a function of the width of the trace and the dielectric of the material between the signal return path and the trace. Once again, if rise times increase enough, the impedance generated as the current tries to flow through this capacitance can be significant. Your drivers read all traces as distributed LC circuits and your trace AC impedance comes from this distributed LC circuit. This is considered uncontrolled impedance. We make no effort to design the trace environment to account for this impedance, allowing the inductance and capacitance to vary as it will along the trace. Since the resultant impedance usually has no effect on operations, there is no need to waste time or money designing ways to control it. How to control impedance of PCB？ Deal with signal integrity issues of PCB Recently, the globe has seen a surge in the switching speeds of most electronic devices. Now more than ever, devices have become complicated and somewhat faster than before. For instance, matters to do with Signal Integrity (SI) are far more recurrent as the device's operational speeds also increase. In other words, devices need to be in an excellent position to deal with any Signal Integrity issues. Apt examples of integrity issues on a printed circuit board include the following: ·Signal loss ·Ringing ·Power supply noise ·Ground bounce ·Crosstalk ·Distortion By following the right design practices, designers can avoid potential SI issues. In this case, controlled impedance can help them in mitigating or averting signal integrity issues.

PCB Knowledge ⋅ 12/26/2022 09:06

What is PCB Reverse Engineering & What Are the Features?

PCB reverse engineering is a multilayered process that includes targeted PCB research, reverse analysis and PCB design technology reproduction. The process is also used to identify and obtain the design of a product’s functional and structural characteristics, as well as the processing flow. With this information, a company can produce products with similar functions and abilities — though businesses will make sure they’re not reproducing an exact replica of a reverse-engineered PCB. PCB Instant Quote .my-button { display: inline-block; padding: 10px 50px; font-size: 16px; text-align: center; text-decoration: none; background-color: blue; color: #fffff0; border: none; border-radius: 5px; font-weight: bold; cursor: pointer; box-shadow: 0px 2px 5px rgba(0, 0, 0, 0.3); transition: background-color 0.3s ease, transform 0.3s ease; } .my-button:hover { background-color: #C23C30; transform: scale(1.05); } Do you know the basic knowledge of PCB reverse engineering? If you are looking for more information about PCB reverse engineering, please check and read the passage for more professional knowledge. What is the definition of PCB reverse engineering? Reverse engineering circuit boards can be a long process, but it’s well worth the payout. There are a few primary stages of reverse engineering PCBs that anyone who attempts to do it should follow. These steps include creating initial drawings, scans or photographs of PCBs that are then uploaded to the appropriate reverse-engineering software and programs. Once uploaded, users have to build the PCB’s layout and use that layout to create schematics. Reverse engineering is primarily utilized to determine and analyze the design principles behind a product. It’s especially useful when a company can’t easily find design information on a specific product. The most common method of reverse engineering a PCB involves disassembling a sample PCB and then analyzing it. From this analysis, a company will create documentation about the sample PCB, which various team members can review. This documentation will often include information about how the product is designed and how it operates. A company can then use the information they gather from a sample PCB to manufacture similar PCBs that may function better than their competitors’ offerings. Alongside reverse engineering’s ability to help companies analyze and outdo competitors’ products, it can also help businesses improve their own PCB offerings. For example, reverse engineering can help them enhance their boards’ functionality by spotting obsolete parts, security issues or poor designs. What is process of Multilayer PCB reverse engineering? · Assign reference designations to unmarked components before starting PCB reverse engineering. · Create a Component level BOM. · Design -Identify the system’s components and their interrelationships. · Components Placement & Mechanical. · XY locations of Connectors, LED, Switches etc. · Board mechanical Mounting holes & any special cuts on Boards, Board size etc. · Download datasheets, application notes, and architecture information. · Create net list. · Make the Schematic Drawing and PCB Layout. Why reverse engineer a PCB? There are several advantages of reverse engineering PCBs — many companies use these devices for various purposes. Reverse engineering can also help you produce more effective or less costly versions of a competitor’s PCBs. Learn more about the advantages of reverse engineering PCBs below: · Maintain crucial PCBs · Get information on PCBs without documentation · Reduce your reliance on experts · Identify weaknesses in a competitor’s designs What are the considerations of PCB reverse engineering? Basically figuring out how the PCB works without the original engineering documentation. You start by creating a schematic by identifying all the components on the board and then finding all of the interconnections. This gives you a schematic which allows you to figure out how the board works. It sound easy but on complex boards in can be extremely time consuming and is frequently made more difficult by the use of complex custom chips. You can actually reverse engineer the actual chips as well, but this is even more specialized and requires a lot of specialized equipment. One of the common uses for reverse engineering is do determine if competitors are using your patents, hardware or Ontellectual property to make their competing products, but there are other malign reasons. Government security agencies do this kind of thing as well to gain insights into other countries weapons susystems, for example. There are specialist companies that perform this kind of work for a fee. If you are right and a competitor is illegally using your patents you may get a financial settlement that will cover your costs, but that is not guaranteed.

PCB Knowledge ⋅ 12/22/2022 14:54

How to Calculate PCB Price in the Manufacturing Industry?

The PCB manufacturing industry is always up against tough competition—and it has to follow strict rules too. On top of that, making PCBs involves a lot of different factors, and each one can change how much the final circuit board costs, all on its own.PCB Instant QuoteIn this passage, check and read the content below for more information about calculating PCB price. To calculate PCB prices on PCBBUY’s instant quote page, follow these steps based on the parameters you select:1. Input Core PCB ParametersSize: Enter the PCB’s height (Y) and width (X) in mm.Quantity: Specify the number of PCBs (e.g., 16 pieces as per your requirement).Material: Choose from options like FR-4, FR-4 (Halogen-Free), FR-4 (Black core), or CEM-1.Layers: Select the number of PCB layers (1, 2, 4, 6, 8, 10, or 12 layers).Number of Designs: Indicate how many distinct PCB designs you need (1, 2, 3, 4, or custom).Board Type: Choose between Single PCB, Panel by Customer (you provide panel layout), or Panel by PCBBUY (they create the panel).2. Specify Manufacturing DetailsThickness: Select the PCB’s thickness (e.g., 0.3mm, 1.6mm, 3.0mm).Finished Copper: Choose copper weight (1oz, 1.5oz, 2oz, 3oz) – this affects current-carrying capacity and cost.Min Track/Spacing: Define the minimum trace width and spacing (e.g., 3/3mil, 8/8mil) – tighter tolerances increase cost.Min Hole Size: Select the smallest via/hole diameter (e.g., 0.15mm, 0.4mm) – smaller holes require more precise drilling.3. Aesthetic & Functional OptionsSolder Mask: Pick a color (Green, White, Black, etc.) – standard colors are cheaper; custom colors (e.g., Matte Green, Purple, Sakura pink) may cost more.Silk Screen: Choose color (White, Black) or “None” – silk screen adds labeling but increases cost.Surface Finish: Select from options like HASL Lead Free, ENIG, Immersion Tin, etc. – finishes like ENIG (gold) are more expensive than HASL.Via Process: Choose how vias are treated (Tenting vias, Plugged vias, etc.) – plugged/epoxy-filled vias add cost.4. Submit & Get Instant QuoteOnce all parameters are selected, the system automatically calculates the price based on PCBBUY’s pricing system, which factors in material costs, manufacturing complexity, quantity discounts, and process-specific expenses. The quote will update in real time as you adjust any parameter.

PCB Knowledge ⋅ 12/21/2022 14:45